1712595

Homogeneous integration of off the shelf silicon-based ICs on a silicon substrate

Balseanu, Mihaela ; Duster, Jon S. ; Kornegay, K.T.

Cornell University

2003

397

402

Etching; Integrated circuit interconnections; Integrated circuit technology; Packaging; Polymers; Silicon; Substrates; Temperature; Thermal conductivity; Thermal expansion;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216308

1216308