Title :
Power cycling simulation of an IC package: considering electromigration and thermal-mechanical failure
Author :
Liu, Yong ; Irving, Scott
Author_Institution :
Fairchild Semiconductor Corp.
Keywords :
Analytical models; Current density; Electromigration; Electronic packaging thermal management; Fatigue; Integrated circuit modeling; Integrated circuit packaging; Semiconductor device packaging; Soldering; Temperature distribution;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216311
