DocumentCode
1712684
Title
Thermo-mechanical failure comparison and evaluation of CCGA and CBGA electronic packages
Author
Perkins, Andy ; Sitaraman, Suresh K.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
422
Lastpage
430
Keywords
Assembly; Ceramics; Computational modeling; Electronic packaging thermal management; Electronics packaging; Joining materials; Soldering; Space technology; Temperature; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216312
Filename
1216312
Link To Document