Title :
Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow process
Author :
Zhang, Zhuqing ; Voyakunpinij, A. ; Sitaraman, Suresh K. ; Wong, C.P.
Author_Institution :
Georgia Institute of Technology
Keywords :
Costs; Curing; Delay; Materials science and technology; Packaging; Semiconductor device modeling; Soldering; Temperature distribution; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216315
