Title :
A novel Modal and Domain Decomposition method for printed Circuit Boards and packages
Author :
Thiel, Werner ; Polstyanko, Sergey ; Bracken, Eric ; Pytel, Steven
Author_Institution :
Ansys, Inc., Pittsburgh, PA, USA
Abstract :
The paper presents a novel Modal and Domain Decomposition approach for fast and accurate analysis of high-speed Printed Circuit Boards (PCBs) and electronic packages. This combined method overcomes both the accuracy limitations of the classic Modal Decomposition Method and the significant performance limitations encountered with any 3D full-wave method. The proposed combined method utilizes an Integral Equation (IE)-based solver for critical 3D regions. The IE solver and the Modal Decomposition solver, which is based on the 2D Finite Element Method (FEM), are seamlessly connected through the admittance matrix at the domain boundary. The accuracy and efficiency of this pioneering method has been verified through an example.
Keywords :
electronics packaging; finite element analysis; integral equations; printed circuit design; 2D finite element method; 3D full-wave method; FEM; admittance matrix; domain decomposition; electronic packaging; integral equation based solver; modal decomposition solver; printed circuit boards; Analytical models; Capacitance; Equations; Mathematical model; Numerical models; Solid modeling; Three-dimensional displays; Domain Decomposition; Integral Equation Method; Modal Decomposition; Signal Integrity;
Conference_Titel :
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location :
Tampa, FL
DOI :
10.1109/MWSYM.2014.6848439
