Title :
RF circuit integration using high Q copper inductors on organic substrate and solder-bumped flip chip technology
Author :
Xiao, Guo-Wei ; Huo, Xiao ; Chan, Philip C H
Author_Institution :
Hong Kong University of Science and Technology
Keywords :
Copper; Flip chip; Glass; Inductors; Integrated circuit interconnections; Integrated circuit technology; Radio frequency; Silicon; Spirals; Voltage-controlled oscillators;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216323
