• DocumentCode
    171305
  • Title

    3D printed plastic 60 GHz lens: Enabling innovative millimeter wave antenna solution and system

  • Author

    Bisognin, Aimeric ; Titz, Diane ; Ferrero, Fabien ; Pilard, Romain ; Fernandes, Carlos A. ; Costa, Jorge R. ; Corre, Christian ; Calascibetta, Pierino ; Riviere, Jean-Michel ; Poulain, Alexis ; Badard, Christian ; Gianesello, Frederic ; Luxey, Cyril ; Bus

  • Author_Institution
    EpOC, Univ. Nice Sophia-Antipolis, Valbonne, France
  • fYear
    2014
  • fDate
    1-6 June 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    During the past years, various research teams developed 60 GHz chipset solutions, using both advanced CMOS [1] and BiCMOS [2] technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key elements. Recently, low cost High Density Interconnect (HDI) organic technology has been evaluated [3, 4] to develop 60 GHz module using antenna-in-package approach. Measured gain is in the order of 4 dBi but there is still a need to achieve higher gain in order to increase the transmit/receive range of the system. The use of a lens is an appealing solution since it enables to customize the system performances while using existing chipset solution. In this paper, we investigate the performances achievable by a plastic (ABS-M30) lens manufactured using low cost and rapid manufacturing 3D printing technology. Material properties at 60 GHz are reviewed, a preliminary 60 GHz lens design is detailed and the full system is validated using a WiGig wireless link (demonstrating a 10 dB improvement in the link budget in comparison with the system without lens).
  • Keywords
    BiCMOS integrated circuits; CMOS integrated circuits; integrated circuit interconnections; lens antennas; millimetre wave antennas; system-on-chip; three-dimensional printing; 3D printed plastic lens; 3D printing technology; ABS-M30; WiGig wireless link; advanced BiCMOS technology; advanced CMOS technology; antenna-in-package approach; chipset solutions; frequency 60 GHz; innovative millimeter wave antenna solution; low cost high density interconnect organic technology; low cost systems-on-chip; low power systems-on-chip; wireless HDMI; Antenna measurements; Antennas; BiCMOS integrated circuits; CMOS integrated circuits; CMOS technology; Three-dimensional displays; 3D printing; 60 GHz; Lens; WiGig; antennas; packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium (IMS), 2014 IEEE MTT-S International
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/MWSYM.2014.6848450
  • Filename
    6848450