Title :
Large die flip chip packaging on organic substrates. the role of finite element analysis (FEA), materials characterization, failure analysis (FA) and test vehicles in development spins
Author :
Goodelle, Jason P. ; Amin, Abmed ; Gilbert, Jeffery ; Horvath, C. ; Nease, Ed ; Vaccaro, Brian T.
Author_Institution :
Agere Systems
Keywords :
Assembly; Failure analysis; Finite element methods; Flip chip; Materials reliability; Materials testing; Optical materials; Packaging; Thermal stresses; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216331
