DocumentCode
1713188
Title
Accurate predictions of flip chip BGA warpage
Author
Li, Yuan
Author_Institution
Altera Corporation
fYear
2003
Firstpage
549
Lastpage
553
Keywords
Application specific integrated circuits; Delamination; Dielectric materials; Dielectric substrates; Electronics packaging; Finite element methods; Flip chip; Predictive models; Soldering; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216334
Filename
1216334
Link To Document