Title :
Accurate predictions of flip chip BGA warpage
Author_Institution :
Altera Corporation
Keywords :
Application specific integrated circuits; Delamination; Dielectric materials; Dielectric substrates; Electronics packaging; Finite element methods; Flip chip; Predictive models; Soldering; Technological innovation;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216334
