Title :
Bumpless flip chip packages for cost/performance driven devices
Author :
Lin, Charles W C ; Chiang, Sam C L ; Yang, T. K Andrew
Author_Institution :
Bridge Semiconductor Corporation
Keywords :
Assembly; Costs; Electronics packaging; Flip chip; Integrated circuit packaging; Routing; Semiconductor device packaging; Substrates; Wafer bonding; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216335
