DocumentCode

1713254

Title

Viscoelastic properties of underfill for numerical analysis of flip chip packages

Author

Sham, Man-Lung ; Kim, Jang-Kyo ; Park, Joo-Hyuk

Author_Institution

Hong Kong University of Science & Technology

fYear

2003

Firstpage

560

Lastpage

566

Keywords

Elasticity; Flip chip; Numerical analysis; Packaging; Polymers; Resins; Soldering; Temperature; Thermal stresses; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216336

Filename

1216336