Title :
Viscoelastic properties of underfill for numerical analysis of flip chip packages
Author :
Sham, Man-Lung ; Kim, Jang-Kyo ; Park, Joo-Hyuk
Author_Institution :
Hong Kong University of Science & Technology
Keywords :
Elasticity; Flip chip; Numerical analysis; Packaging; Polymers; Resins; Soldering; Temperature; Thermal stresses; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216336
