Title :
Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias
Author :
Tanaka, Naotaka ; Yamaji, Yasuhiuo ; Sato, Tomotoshi ; Takahashi, Kenji
Author_Institution :
Association of Super-Advanced Electronics Technologies (ASET)
Keywords :
Copper; Gold; Guidelines; Materials reliability; Packaging; Resins; Silicon; Stacking; Temperature; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216342
