Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias

Author

Tanaka, Naotaka ; Yamaji, Yasuhiuo ; Sato, Tomotoshi ; Takahashi, Kenji

Author_Institution

Association of Super-Advanced Electronics Technologies (ASET)

fYear

2003

Firstpage

597

Lastpage

602

Keywords

Copper; Gold; Guidelines; Materials reliability; Packaging; Resins; Silicon; Stacking; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216342

Filename

1216342

Link To Document