DocumentCode

1713550

Title

IC stacking technology using fine pitch, nanoscale through silicon vias

Author

Spiesshoefer, S. ; Schaper, L.

Author_Institution

University of Arkansas

fYear

2003

Firstpage

631

Lastpage

633

Keywords

Chemical vapor deposition; Copper; Delay; Fabrication; Image sensors; Logic; Sensor arrays; Silicon; Stacking; Titanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216347

Filename

1216347