Title :
Mgh density electroplating bonding interconnect technology: chip packaging and high aspect ratio passive elements
Author :
Joung, Yeun-Ho ; Allen, Mark G.
Author_Institution :
Georgia Institute of Technology
Keywords :
Conducting materials; Electronic packaging thermal management; Fabrication; Inductors; Integrated circuit interconnections; Lead; Testing; Thermal stresses; Wafer bonding; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216349
