DocumentCode :
1713633
Title :
Using PDMS microtransfer molding (/apl mu/TM) for polymer flip chip
Author :
Wong, Cell K Y ; Cheung, Otto C T ; Bing Xu ; Yuen, Matthew M F
Author_Institution :
Hong Kong University of Science and Technology
fYear :
2003
Firstpage :
652
Lastpage :
657
Keywords :
Electric resistance; Electric variables measurement; Electrical resistance measurement; Electronic components; Flip chip; Metallization; Optical microscopy; Polymers; Resists; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216351
Filename :
1216351
Link To Document :
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