Title :
Improvement in the properties of Sn-Zn Eutectic based Pb-free solder
Author :
Lin, Kwang-Lung ; Chen, Kang-I ; Hsu, Hui-Min ; Shi, Chia-Ling
Author_Institution :
National Cheng Kung University
Keywords :
Artificial intelligence; Laboratories; Lead; Manufacturing; Mechanical factors; Oxidation; Temperature; Tensile strain; Tin; Zinc;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216352
