• DocumentCode
    1713750
  • Title

    Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

  • Author

    Jang, Jin-Wook ; De Silva, Ananda ; Lin, Jong-Kai ; Frear, Darrel

  • Author_Institution
    Motorola, Semiconductor Products Sector
  • fYear
    2003
  • Firstpage
    680
  • Lastpage
    684
  • Keywords
    Annealing; Environmentally friendly manufacturing techniques; Flip chip; Lead compounds; Mechanical factors; Microstructure; Soldering; Solid state circuits; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216356
  • Filename
    1216356
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713750