• DocumentCode
    1713775
  • Title

    A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties

  • Author

    Gong, Jig-Feng ; Xiao, Guo-Wei ; Chan, Philip C.H. ; Lee, Ricky S W ; Yuen, Matthew M F

  • Author_Institution
    The Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    685
  • Lastpage
    691
  • Keywords
    Copper; Current density; Gold; Intermetallic; Microstructure; Packaging; Printing; Rough surfaces; Surface morphology; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216357
  • Filename
    1216357
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713775