• DocumentCode
    1713778
  • Title

    Electromagnetic emissions: IC-level versus system-level

  • Author

    Deutschmann, Bernd ; Winkler, Gunter ; Ostermann, Timm ; Lamedschwandner, Kurt

  • Author_Institution
    Schloss Premstatten, austriamicrosystems AG, Unterpremstatten, Austria
  • Volume
    1
  • fYear
    2004
  • Firstpage
    169
  • Abstract
    The electromagnetic emission (EME) of integrated circuits (ICs) is very often the reason why an electronic system in which these ICs are implemented does not meet the regulatory limits and performance compatibility with other electronic devices. Even though, in the meantime, unified measurement methods at the IC-level are proposed in two standards, a so-called "missing link" exists between EMC measurements at the IC-level and system-level, respectively. Furthermore, no information is available on how to estimate the EMC behavior of an electronic system from the characterized EMC behavior of the IC which is used in the system. Besides a brief overview of some legal requirements and measurement methods at the system-level and the measurement methods at the IC-level, we present an approach to reduce the gap between the IC-level and the system-level by the calculation of the far field emissions from current measurements of IC pins on a printed circuit board (PCB).
  • Keywords
    electric noise measurement; electromagnetic compatibility; electromagnetic interference; integrated circuits; legislation; printed circuits; EMC measurements; IC-level electromagnetic emissions; electronic devices; far field emissions; legal requirements; performance compatibility; regulatory limits; system-level electromagnetic emissions; Current measurement; Electromagnetic compatibility; Electromagnetic devices; Electromagnetic measurements; Integrated circuit measurements; Law; Legal factors; Measurement standards; Pins; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
  • Print_ISBN
    0-7803-8443-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2004.1350019
  • Filename
    1350019