DocumentCode
1713818
Title
Experimental and modeling analysis of the reliability of the anisotropic conductive films
Author
Yin, C.Y. ; Lu, H. ; Bailey, C. ; Chan, Y.C.
Author_Institution
The University of Greenwich
fYear
2003
Firstpage
698
Lastpage
702
Keywords
Anisotropic conductive films; Anisotropic magnetoresistance; Assembly; Conductive adhesives; Contact resistance; Flip chip; Polymer films; Semiconductor device modeling; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216359
Filename
1216359
Link To Document