DocumentCode :
1713981
Title :
Electrical properties of SBT capacitor with top electrodes
Author :
Cho, C.N. ; Kim, J.S. ; Oh, Y.C. ; Lee, D.K. ; Choi, W.S. ; Shin, C.G. ; Kim, C.H. ; Lee, J.U.
Author_Institution :
Dept. of Electr. Eng., Kwangwoon Univ., Seoul, South Korea
Volume :
3
fYear :
2005
Firstpage :
596
Abstract :
The Sr0.8Bi2.2Ta2O9 (SBT) thin films are deposited on Pt-coated electrode (Pt/TiO2/SiO2/Si) using RF magnetron sputtering method. The electrical properties of SBT capacitors with top electrodes were studied. In the XRD pattern, the SBT thin films in all annealing temperatures had (105) orientation. In the SEM images, bi-layered perovskite phase was crystallized at 750 °C and grains largely grew in oxygen annealing atmosphere. The electrical properties of SBT capacitor with top electrodes represents a favorable properties in Pt electrode. The maximum remanent polarization and the coercive electric field with Pt electrode are 12.40μC/cm2 and 30 kV/cm respectively. The dielectric constant and leakage current density with Pt electrode is 340 and 6.81 x 10-10 A/cm2 respectively.
Keywords :
X-ray diffraction; annealing; bismuth compounds; current density; dielectric polarisation; electric fields; electrodes; leakage currents; permittivity; platinum; scanning electron microscopy; sputtering; strontium compounds; thin film capacitors; 750 degC; Pt-TiO2-SiO2-Si; Pt-coated electrode; RF magnetron sputtering method; SBT capacitor; SEM images; Sr0.8Bi2.2Ta2O9; XRD pattern; bilayered perovskite; dielectric constant; electric field; electrical properties; leakage current density; oxygen annealing atmosphere; thin films; Annealing; Bismuth; Capacitors; Electrodes; Radio frequency; Semiconductor thin films; Sputtering; Strontium; Temperature; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
Type :
conf
DOI :
10.1109/ISEIM.2005.193439
Filename :
1496243
Link To Document :
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