1713999

Mechanical properties of packaging materials -the need and a strategy for an educational module

Wiese, Steffen ; Wolter, Klaus-juergen

Dresden University of Technology

2003

743

747

Assembly; Education; Electronic packaging thermal management; Electronics packaging; Flip chip; Materials science and technology; Mechanical engineering; Mechanical factors; Stress; Thermomechanical processes;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216367

1216367