Title :
A new method to fabricate low-loss chip-scale RF inductors
Author :
Nation, Joshua C. ; Fiering, Jason ; White, Douglas ; Abban, Michael ; Culpepper, Martin L. ; Duwel, Amy
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
Abstract :
A new method is presented for integrating high performance wire-based inductors into thin, planar, chip-scale formats. The method is designed for compatibility with commonly-used rapid prototyping tools, and fabrication can be automated for volume production. The chip-scale inductors are designed for inductances in the 1-10 nH range, self-resonant frequencies above 5 GHz, and quality factors exceeding 75-100. The process can produce a stand-alone chip or can be integrated with existing multi-chip modules and integrated circuits.
Keywords :
Q-factor; chip scale packaging; inductors; rapid prototyping (industrial); chip-scale inductors; high performance wire-based inductors; integrated circuits; multichip modules; rapid prototyping tools; stand-alone chip; thin planar chip-scale formats; volume production; CMOS integrated circuits; Films; Q-factor; Radio frequency; Resonant frequency; Substrates; Inductor; integrated passives; multi-chip module; quality factor; radio frequency;
Conference_Titel :
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location :
Tampa, FL
DOI :
10.1109/MWSYM.2014.6848504