Title :
Fusion of Fiber-Optic and PCB Technologies for In-board Optical Interconnection
Author :
Park, Hyo-Hoon ; Hwang, Sung Hwan ; Cho, Mu Hee ; Kang, Sae-Kyoung ; Lee, Tae-Woo
Author_Institution :
Inf. & Commun. Univ., Daejeon
Abstract :
To implement an optically-data-linked computer system, we proposed a chip-to-chip optical interconnection platforms based on fiber-embedded printed-circuit boards (PCBs) and fiber-optic components for assembly. The 90deg deflection of light between the optical PCB and transceiver modules were achieved using 90deg-bent fiber blocks. The connection blocks and optical transceiver modules were passively assembled in/on the optical PCB, employing the guide pins/hole of the conventional ferrules. An optical link of 7 Gb/s/ch signals with a low optical loss of -5.3 dB have been demonstrated from the assembled platform.
Keywords :
optical fibres; optical interconnections; optical links; optical losses; printed circuit accessories; transceivers; PCB technologies; bit rate 7 Gbit/s; fiber-embedded printed-circuit boards; fiber-optic components; fiber-optic fusion; in-board optical interconnection; loss -5 dB; loss -5.3 dB; optical link; optical transceiver modules; optically-data-linked computer system; Assembly; High speed optical techniques; Optical fiber communication; Optical films; Optical interconnections; Optical polymers; Optical receivers; Optical transmitters; Packaging; Pins; Optical interconnection; fiber optic; optical-PCB; passive packaging;
Conference_Titel :
Photonics in Switching, 2006. PS '06. International Conference on
Conference_Location :
Heraklion, Crete
Print_ISBN :
978-0-7803-9790-3
Electronic_ISBN :
978-0-7803-9790-3
DOI :
10.1109/PS.2006.4350170