Title :
Electrical and thermal properties of semiconductive shield for 154 kV power cable
Author :
Lee, Kyoung-Yong ; Nam, Jong-Chul ; Park, Dong-Ha ; Park, Dae-Hee
Author_Institution :
Sch. of Electr., Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea
Abstract :
To improve mean-life and reliability of power cable, in this study, we have investigated volume resistivity and thermal properties showing by changing the content of carbon black, a semiconductive material for underground power transmission. Specimens were made of sheet form with the nine of specimens for measurement. Volume resistivity of specimens was measured by volume resistivity meter after 10 minutes in the preheated oven of both 25 ± 1°C and 90 ±1 °C. And thermal conductivity was measured by NFD (nano flash diffusivity). The measurement temperature was both 25 °C and 55 °C. From these experimental results, volume resistivity was high according to an increase of the content of carbon black. And thermal conductivity was increased according to an increase of the content of carbon black and also was increased by heating temperature. Because the movement of thermal electrons was rapidly promoted between carbon black particles, and the thermal vibrations of base resin atoms and carbon black thermal electrons were increased.
Keywords :
power cables; power transmission reliability; resins; semiconductor materials; thermal conductivity; underground cables; underground transmission systems; 154 kV; 25 degC; 55 degC; C; carbon black particles; electrical properties; nanoflash diffusivity; power cable reliability; resin atoms; semiconductive material; semiconductive shield; thermal conductivity; thermal properties; thermal vibrations; underground power transmission; volume resistivity; Conducting materials; Electrons; Materials reliability; Organic materials; Power cables; Semiconductor device reliability; Temperature measurement; Thermal conductivity; Thermal resistance; Underground power cables;
Conference_Titel :
Electrical Insulating Materials, 2005. (ISEIM 2005). Proceedings of 2005 International Symposium on
Print_ISBN :
4-88686-063-X
DOI :
10.1109/ISEIM.2005.193444