DocumentCode :
1714427
Title :
Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling
Author :
Farooq, Mukta ; Goldmann, L. ; Martin, Gregov ; Goldsmith, Charles ; Bergeron, Christian
Author_Institution :
IBM Microelectronics
fYear :
2003
Firstpage :
827
Lastpage :
833
Keywords :
Assembly; Capacitive sensors; Ceramics; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Predictive models; Thermomechanical processes; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216385
Filename :
1216385
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1714427
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