DocumentCode
1714485
Title
Fracture toughness of Cu-Sn intennetallic compounds in electronic packages
Author
Chen, Zhong ; Cahyadi, Tommy ; Li, Ming ; Balakrisnan, Bavani ; Chum, Chan Choy
Author_Institution
Nanyang Technological University
fYear
2003
Firstpage
844
Lastpage
847
Keywords
Capacitive sensors; Electronics packaging; Intermetallic; Soldering; Sputtering; Strain measurement; Testing; Thickness measurement; Tin; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216388
Filename
1216388
Link To Document