Title :
Fracture toughness of Cu-Sn intennetallic compounds in electronic packages
Author :
Chen, Zhong ; Cahyadi, Tommy ; Li, Ming ; Balakrisnan, Bavani ; Chum, Chan Choy
Author_Institution :
Nanyang Technological University
Keywords :
Capacitive sensors; Electronics packaging; Intermetallic; Soldering; Sputtering; Strain measurement; Testing; Thickness measurement; Tin; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216388
