Title :
Room temperature bonding of ultra-fine pitch and low-profiled Cu electrodes for bump-less interconnect
Author :
Shigetou, A. ; Itoh, T. ; Matsuo, M. ; Hayasaka, N. ; Oktumura, K. ; Suga, T.
Author_Institution :
the Univ. of Tokyo
Keywords :
Bonding; Electrical resistance measurement; Electrodes; Insulation; Ion beams; Large scale integration; Packaging; Surface cleaning; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216389
