DocumentCode
1714514
Title
Room temperature bonding of ultra-fine pitch and low-profiled Cu electrodes for bump-less interconnect
Author
Shigetou, A. ; Itoh, T. ; Matsuo, M. ; Hayasaka, N. ; Oktumura, K. ; Suga, T.
Author_Institution
the Univ. of Tokyo
fYear
2003
Firstpage
848
Lastpage
852
Keywords
Bonding; Electrical resistance measurement; Electrodes; Insulation; Ion beams; Large scale integration; Packaging; Surface cleaning; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216389
Filename
1216389
Link To Document