DocumentCode
1714529
Title
Improvement in WL-CSP reliability by wafer thinning
Author
Wetz, Li ; White, Jerry ; Keser, Beth
Author_Institution
Motorola SPS
fYear
2003
Firstpage
853
Lastpage
856
Keywords
Chip scale packaging; Costs; Electronics packaging; Etching; Performance evaluation; Plasma applications; Substrates; Testing; Thermal stresses; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216390
Filename
1216390
Link To Document