Title :
Improvement in WL-CSP reliability by wafer thinning
Author :
Wetz, Li ; White, Jerry ; Keser, Beth
Author_Institution :
Motorola SPS
Keywords :
Chip scale packaging; Costs; Electronics packaging; Etching; Performance evaluation; Plasma applications; Substrates; Testing; Thermal stresses; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216390
