1714547

An analysis of the reliability of a wafer level package (WLP) using a silicone under the bump (SUB) configuration

Gonzalez, M. ; Vandevelde, B. ; BuIcke, M.V. ; Winters, C. ; Beyne, E. ; Lee, Y.J. ; Larson, Lawrence ; HArkness, B.R. ; Mohamed, M. ; Meynen, H. ; Vanlathem, E.

IMEC

2003

857

863

Capacitive sensors; Integrated circuit reliability; Lead; Material properties; Metallization; Packaging; Plastics; Soldering; Thermal stresses; Wafer scale integration;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216391

1216391