• DocumentCode
    1714695
  • Title

    Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages

  • Author

    Polyakov, A. ; Mendes, P.M. ; Sinaga, S.M. ; Bartek, M. ; Rejaci, B. ; Correia, J.H. ; Burghartz, Joachim N.

  • Author_Institution
    Delft University of Technology
  • fYear
    2003
  • Firstpage
    875
  • Lastpage
    880
  • Keywords
    Chip scale packaging; Dielectric losses; Dielectric substrates; Electric variables; Etching; Glass; Radio frequency; Rough surfaces; Silicon; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216394
  • Filename
    1216394
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714695