Title :
Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
Author :
Polyakov, A. ; Mendes, P.M. ; Sinaga, S.M. ; Bartek, M. ; Rejaci, B. ; Correia, J.H. ; Burghartz, Joachim N.
Author_Institution :
Delft University of Technology
Keywords :
Chip scale packaging; Dielectric losses; Dielectric substrates; Electric variables; Etching; Glass; Radio frequency; Rough surfaces; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216394
