• DocumentCode
    1714753
  • Title

    A non-destructive visual failure analysis technique for cracked BGA interconnects

  • Author

    Bragg, Jason ; Bookbinder, Justine ; Sanders, George ; Harper, Blake

  • Author_Institution
    Celestica Intemational Inc.
  • fYear
    2003
  • Firstpage
    886
  • Lastpage
    890
  • Keywords
    Assembly; Capacitive sensors; Circuit testing; Endoscopes; Failure analysis; Force control; Inspection; Integrated circuit interconnections; Manufacturing; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216396
  • Filename
    1216396
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714753