Title :
Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior
Author :
Sahasrabudhe, Sameer ; Monroe, Eric ; Tandon, Shalabh ; Patel, Mitesh
Author_Institution :
Intel Corporation
Keywords :
Electric shock; Electronic packaging thermal management; Fatigue; Life estimation; Life testing; Material properties; Materials reliability; Stress; Temperature; Thermal loading;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216398
