Title :
Characterization of die stresses in flip chip on laminate assemblies using
Author :
Rahim, M. Kaysar ; Sulding, J.C. ; Copeland, D. Scott ; Jaeger, Richard C. ; Lall, Pradeep ; Johnson, R. Wayne
Author_Institution :
Auburn University
Keywords :
Assembly; Flip chip; Laminates; Semiconductor device measurement; Silicon; Stress measurement; Temperature; Tensile stress; Testing; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216399
