Title :
A novel defect detection technique using active transient thermography for high density package and interconnections
Author :
Chai, T.C. ; Wong, Brian S. ; Bai, W.M. ; Trigg, A. ; Lain, Y.K.
Author_Institution :
Institute of Microclectronics
Keywords :
Assembly; Circuit faults; Electric resistance; Integrated circuit interconnections; Integrated circuit packaging; Isolation technology; Nonhomogeneous media; Soldering; X-ray detection; X-ray detectors;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216400
