Title :
Application of digital speckle correlation to micro-deformation measurement of a flip chip assembly
Author :
Pang, John H L ; Shi, X.Q. ; Zhang, X.R. ; Liu, Q.J.
Author_Institution :
Nanyang Technological University
Keywords :
Adaptive optics; Assembly; Digital images; Electronic packaging thermal management; Electronics packaging; Flip chip; Optical interferometry; Semiconductor device measurement; Soldering; Speckle;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216401
