• DocumentCode
    171489
  • Title

    A package-integratable six-port reflectometer for power devices

  • Author

    Venter, Razvan G. ; Rui Hou ; Buisman, Koen ; Spirito, M. ; Werner, K. ; de Vreede, Leo C. N.

  • Author_Institution
    Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2014
  • fDate
    1-6 June 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    High frequency power devices require specific loading conditions to provide maximum output power, operate efficiently and avoid self-destruction. In applications with unknown or time varying loading conditions it is therefore desirable to monitor, in-situ, the loading conditions offered to the PA. This work proposes an ultra-compact six-port package-integratable reflectometer. The resulting structure is implemented on a 9.4×4 mm2 substrate that can fit into an SOT1110A package. The performance of the realized hardware is validated by an active load-pull system, which synthesizes impedances covering the entire Smith chart.
  • Keywords
    power amplifiers; reflectometers; PA; Smith chart; active load-pull system; package-integratable six-port reflectometer; power devices; time varying loading conditions; ultra-compact six-port package-integratable reflectometer; Abstracts; Frequency measurement; Layout; Load modeling; Microwave measurement; Monitoring; Pollution measurement; Bondwire; directional coupler; package integration; power amplifier; reflection coefficient measurement; six-port reflectometer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium (IMS), 2014 IEEE MTT-S International
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/MWSYM.2014.6848549
  • Filename
    6848549