DocumentCode
171489
Title
A package-integratable six-port reflectometer for power devices
Author
Venter, Razvan G. ; Rui Hou ; Buisman, Koen ; Spirito, M. ; Werner, K. ; de Vreede, Leo C. N.
Author_Institution
Delft Univ. of Technol., Delft, Netherlands
fYear
2014
fDate
1-6 June 2014
Firstpage
1
Lastpage
4
Abstract
High frequency power devices require specific loading conditions to provide maximum output power, operate efficiently and avoid self-destruction. In applications with unknown or time varying loading conditions it is therefore desirable to monitor, in-situ, the loading conditions offered to the PA. This work proposes an ultra-compact six-port package-integratable reflectometer. The resulting structure is implemented on a 9.4×4 mm2 substrate that can fit into an SOT1110A package. The performance of the realized hardware is validated by an active load-pull system, which synthesizes impedances covering the entire Smith chart.
Keywords
power amplifiers; reflectometers; PA; Smith chart; active load-pull system; package-integratable six-port reflectometer; power devices; time varying loading conditions; ultra-compact six-port package-integratable reflectometer; Abstracts; Frequency measurement; Layout; Load modeling; Microwave measurement; Monitoring; Pollution measurement; Bondwire; directional coupler; package integration; power amplifier; reflection coefficient measurement; six-port reflectometer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/MWSYM.2014.6848549
Filename
6848549
Link To Document