Title :
Novel reworkable fluxing underfill for board level assembly
Author :
Zhang, Zhuqing ; Li, Haiying ; Wong, C.P.
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Chip scale packaging; Electric shock; Electronics packaging; Materials science and technology; Soldering; Surface-mount technology; Temperature; Thermal stresses; Vehicle dynamics;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216403
