DocumentCode
1714924
Title
The effects of rheological properties on underfifl processing
Author
Wang, Jinlin
Author_Institution
Intel Corporation
fYear
2003
Firstpage
946
Lastpage
950
Keywords
Aging; Curing; Environmentally friendly manufacturing techniques; Packaging; Performance evaluation; Rheology; Stress; Temperature measurement; Testing; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216404
Filename
1216404
Link To Document