Title :
Effects on etching rates of copper in ferric chloride solutions
Author :
Jian, Cai ; Jusheng, Ma ; Gangqiang, Wang ; Xiangyun, Tang
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
The influences of several factors on the etching rates of Cu in FeCl3 etchant are studied with a spray etching apparatus in this paper. The Cu etching surfaces are analyzed by XRD, and it is shown that there is a CuCl passivation film on the etching surface. A brief explanation is offered based on the relationship between etching rate and etching time. It indicates that cations influence the etching rate as the effects of different chlorides on etching rates have been studied. Additionally, the quantity of copper dissolved in FeCl3 etchant and regeneration of spent etchants are also investigated in this paper
Keywords :
X-ray diffraction; copper; etching; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; iron compounds; passivation; positive ions; surface chemistry; Cu; Cu etching rate; Cu etching surfaces; CuCl passivation film; FeCl3; FeCl3 etchant; IC packaging; XRD analysis; cations; copper etching; dissolved copper; etching rate; etching rates; etching surface; etching time; ferric chloride solutions; lead frames; spent etchant regeneration; spray etching apparatus; Copper alloys; Electronic packaging thermal management; Electronics packaging; Etching; Iron alloys; Lead; Materials science and technology; Photochemistry; Spraying; X-ray scattering;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704541
