Title :
Nanocomposite underfills for flip-chip applications
Author :
Gross, Kenny ; Schultz, Wolfram ; Thompson, Willem
Author_Institution :
3M Company
Keywords :
Assembly; Bonding; Material properties; Materials science and technology; Packaging; Silicon compounds; Soldering; Thermal expansion; Thermal stresses; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216405
