Title :
Underfill-induced stresses in flip chip assemblies
Author :
Hurley, James M. ; Berfield, Tanya L.
Author_Institution :
Cookson Electronics-Assembly Materials Groups
Keywords :
Assembly; Capacitive sensors; Flip chip; Laminates; Monitoring; Soldering; Stress measurement; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216406
