• DocumentCode
    1714987
  • Title

    Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level application

  • Author

    Zhang, Zhuqing ; Wong, C.P.

  • Author_Institution
    Georgia Institute of Technology
  • fYear
    2003
  • Firstpage
    971
  • Lastpage
    977
  • Keywords
    Assembly; Curing; Delay; Kinetic theory; Material storage; Materials science and technology; Predictive models; Semiconductor device modeling; Soldering; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216408
  • Filename
    1216408
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1714987