Title :
Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level application
Author :
Zhang, Zhuqing ; Wong, C.P.
Author_Institution :
Georgia Institute of Technology
Keywords :
Assembly; Curing; Delay; Kinetic theory; Material storage; Materials science and technology; Predictive models; Semiconductor device modeling; Soldering; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216408
