Title :
Materials characterization and requirements of package applied underfill
Author :
Shah, Jayesh ; Morganelli, Paul ; Wheelock, Brian
Author_Institution :
Emerson & Cuming
Keywords :
Assembly; Chip scale packaging; Costs; Curing; Electronics packaging; Manufacturing; Mechanical factors; Soldering; Surface-mount technology; Throughput;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216409
