Title :
Electrical modeling of global interconnects with electromagnetic accuracy
Author :
Rong, Aosheng ; Cangellaris, Andreas C.
Author_Institution :
University of Elinois
Keywords :
Electromagnetic analysis; Electromagnetic modeling; Equivalent circuits; Frequency; Integral equations; Integrated circuit interconnections; Numerical stability; Packaging; Power system interconnection; System-on-a-chip;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216410
