Title :
Accurate HSPICE modeling of arbitrary package geometries using transmission-line equivalent techniques
Author :
Budell, T. ; Clouser, P. ; Tremble, E. ; Welch, B.
Author_Institution :
IBM Corporation
Keywords :
Application specific integrated circuits; Equivalent circuits; Geometry; Power transmission lines; Semiconductor device noise; Semiconductor device packaging; Solid modeling; Stripline; Switching frequency; Transmission lines;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216411
