Title :
3GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect
Author :
Pak, Jun So ; Kim, Joungho
Author_Institution :
KAIST (Korea Advanced Institute of Science and Technology)
Keywords :
Distortion; Equivalent circuits; Frequency; Impedance; Integrated circuit interconnections; Neck; Packaging; Printed circuits; Resonance; Routing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216414
