Title :
Chip-to-wafer stacking technology for 3D system integration
Author :
Klumpp, Armin ; Merkel, Reinhard ; Wieland, Robert ; Ramm, Peter
Author_Institution :
Fraunhofer Institute for Reliability and Microintegration IZM
Keywords :
Contacts; Copper; Etching; Fabrication; Metallization; Microelectronics; Soldering; Stacking; Wafer bonding; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216424
