DocumentCode

1715434

Title

Design and stacking of an extremely thin chip-scale package

Author

Yoshida, Akito ; Ishibashi, Kamo

Author_Institution

Amkor Technology Inc.

fYear

2003

Firstpage

1095

Lastpage

1100

Keywords

Bonding; Chip scale packaging; Costs; Encapsulation; Laminates; Lead; Logic devices; Logistics; Stacking; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216427

Filename

1216427