Title :
Stacked 3-D MCP with plastic ball vertical interconnections
Author :
Miettinen, Jani ; Tanskaneu, J. ; Ristolainen, Eero O.
Author_Institution :
Tampere University of Technology
Keywords :
Consumer electronics; Electric variables; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Semiconductor device packaging; Stacking; Testing; Thermal management; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216428
